Bonding Wire

Bonding Wire Aluminum    Share

Aluminum

  • Merit
    · Outstanding mechanical strength
    · High temperature maintenance
    · Excellent high heat resistance characteristics of power devices
      (recrystallization temperature improved by 50℃)
  • Fine Al wire
    · 1% Si-AI Wire
    · 0.0007 to 0.003 inches or 18 to 76µm
  • Heavy Al wire
    · 0.005 to 0.020 inches or 125 to 500 µm
    · Multiple formulations: 99.99% Corrosion Resistant
    99.999% High Purity
  • Al Ribbon
    · Reduce total number of bonds Higher : UPH, Greater capacity utilization
    · Higher power handling : Larger Cross-sectional area per bond
    · Improved circuit performance