Bonding Wire

Bonding Wire Au / Ag / Cu    Share

Au / Ag / Cu

Application
· Semiconductor, LED, Camera module, Sensor
그래프
Type
Material Melting (℃) Density (g/㎤) Hv Tensile (Mpa) Resistivity (μΩ.㎝)
Au(99.99%) 1,064 19.32 47-53 120 2.5
AuAg20% 1,040 15.7 59-66 230 10.26
Cu(99.99%) 1,083 8.96 57-62 210 1.74
Pd-Cu 1,083 8.98 72-77 210 1.86
Ag(95%) 1,010 10.58 58-63 180 1.95
그래프
Capacity
· Diameter : 0.015㎜ ~ 0.05㎜
· Length per spool : 50m ~ 2,000m
· Productivity : 1,000km/Month
· Available other alloy wires by customer’s needs
· Clean surface and unique cleaning process