Brazing / Soldering

Brazing / Soldering Active Brazing    Share

Active Brazing

Amorphous brazing metal(Vacuum & Activity)
Process
제조공정이미지
Type
Item Alloys Melting(℃) Working temp.(℃) Remark
VBAG-8 Ag72Cu28 780 780 For vacuum
TKC-651 AgCuSnTi계 770 770 Ceramic + Metal
TKC710 AgCu28Tİ2 780-785 785 Ceramic + Metal
AMF-T2020 TiBal Zr20Cu20Ni20 848-856 856-885 AWS BTi-5
AMF-Z1724 ZrBal Ti17.2Ni24 798-809 810-840 -
AMF-Z1412 ZrBal Ti14.2Cu6.8Ni12.6 774-783 783-810 Super lowest
lting alloy
Capacity(Tape)
· Thinkness : 0.03mm ~ 0.1mm
· Width : Max 75mm
· Productivity : 2,000kg/month
· Min Oder : 1kg
tape이미지1
tape이미지2
tape이미지3
Active solder

Ⅰ. Bonding mechanism

Titanium which is distributed in the solder gathers at the ceramic bonding interface and reacts with oxygen or nitrogen in the ceramic and bonds.

Ti6Al4V+SS304
Cu+CP Ti
Al2O3+Ti alloy
Ti honeycomb
Ti heat exchanger
SiC+CP Ti

Ⅱ. Strength

· Brazing for ceramics or ceramic and metal
· No needs metallizing and brazing to ceramics directly
· Improvement brazing ability

Merits of the Low Melting Temp. Filler metals
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